1. Transient Thermal Analysis:
Create a geometric representation of a plate then apply thermal load of convection, heat generation, heat flux, and fixed temperature to the model. Run a transient heat transfer analysis of the plate.
1. Transient Thermal Analysis:
Create a geometric representation of a plate then apply thermal load of convection, heat generation, heat flux, and fixed temperature to the model. Run a transient heat transfer analysis of the plate.
2. Fluid Advection Thermal Analysis:
Create a geometric representation of a rectangular duct then apply appropriate convection and advection loads to model the airflow through the duct of this heat exchanger. Add a constant heat flux to one side of the duct and run a steady-state heat transfer analysis of the duct.
3. Radiation Enclosures:
Create a geometric representation of three plates and apply a thermal load of heat flux to a patch in the middle
surface. Apply thermal load of shaded radiation to the outer surfaces then run a steady-state heat transfer analysis of the plates.
4. Directional Heat Loads:
Create a geometric model of a cylinder then apply ambient radiation to space and a directional heat flux to the model. Run a steady-state heat transfer analysis on the model.
5. Thermal Stress Analysis from Directional Heat Loads:
Open an existing MSC/NASTRAN for Windows model. Create a temperature load based on the previous analysis’ output and apply constraints to the ends of the cylinder. Run a linear static analysis on the model to obtain stresses due to constraining thermal expansion.
6. Free Convection on a Printed Circuit Board:
Create a geometric representation of a printed circuit board then apply thermal loading of free convection and heat fluxes to the model. Run a steady-state heat transfer analysis of the board.
7. Forced Convection on a Printed Circuit Board:
Create a geometric representation of a plate then apply thermal loading of forced convection and heat fluxes to the model. Run a steady-state heat transfer analysis of the plate.